3D Integration of Power MOSFETs Drives Performance in Low-voltage Synchronous Buck Converters

摘要

Efficiency and power loss in microelectronic devices are major issues in power electronics applications. Engineers are challenged every year to increase power density and at the same time reduce the amount of power dissipated in the applications to keep the maximum temperatures under specifications. This situation drives a constant demand for better efficiencies in smaller packages. Traditional approaches to improve efficiency in DC/DC synchronous buck converters include reducing conduction losses in the MOSFETs through lower R_(DS(on)) devices and lowering switching losses through low-frequency operation.