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首页> 外文期刊>Applied physics express >Monolithic integration of E/D-mode GaN MIS-HEMTs on ultrathin-barrier AlGaN/GaN heterostructure on Si substrates
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Monolithic integration of E/D-mode GaN MIS-HEMTs on ultrathin-barrier AlGaN/GaN heterostructure on Si substrates

机译:E / D模式GaN MIS-HEMT在Si衬底上超薄势垒AlGaN / GaN异质结构上的单片集成

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摘要

Monolithically integrated enhancement/depletion-mode (E/D-mode) GaN-based metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) and inverters, were fabricated on an ultrathin-barrier (UTB) AlGaN/GaN heterostructure grown on Si substrates. By employing a graded AlGaN back barrier in the UTB-AlGaN/GaN heterostructure, a high threshold voltage (V-TH) of + 3.3 V is achieved in the E-mode MIS-HEMTs. The fabricated MIS-HEMT inverter features a high logic swing voltage of 7.76 V at a supply voltage of 8 V, a small V-TH-hysteresis as well as-deviation less than 0.2 V. The UTB AlGaN/GaN-on-Si technology provides a good platform for integration of MIS-gate-based drivers and power transistors. (C) 2019 The Japan Society of Applied Physics
机译:在超薄势垒(UTB)AlGaN / GaN异质结构上制造了单片集成增强/耗尽模式(E / D模式)GaN基金属绝缘体半导体高电子迁移率晶体管(MIS-HEMT)和反相器在Si衬底上生长。通过在UTB-AlGaN / GaN异质结构中采用渐变AlGaN背势垒,可以在E模式MIS-HEMT中实现+ 3.3 V的高阈值电压(V-TH)。制成的MIS-HEMT逆变器在8 V的电源电压下具有7.76 V的高逻辑摆幅电压,较小的V-TH磁滞以及偏差小于0.2V。UTB AlGaN / GaN-on-Si技术为集成基于MIS门的驱动器和功率晶体管提供了一个很好的平台。 (C)2019日本应用物理学会

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  • 来源
    《Applied physics express》 |2019年第2期|024001.1-024001.4|共4页
  • 作者单位

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China|Univ Chinese Acad Sci, Beijing 100049, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China|Univ Chinese Acad Sci, Beijing 100049, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China|Univ Chinese Acad Sci, Beijing 100049, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China|Univ Chinese Acad Sci, Beijing 100049, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China|Univ Chinese Acad Sci, Beijing 100049, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China|Univ Chinese Acad Sci, Beijing 100049, Peoples R China;

    Chinese Acad Sci, Suzhou Inst Nanotech & Nanobion, Suzhou 215123, Peoples R China;

    Chinese Acad Sci, Suzhou Inst Nanotech & Nanobion, Suzhou 215123, Peoples R China;

    Chinese Acad Sci, Suzhou Inst Nanotech & Nanobion, Suzhou 215123, Peoples R China;

    Hong Kong Univ Sci & Technol, Kowloon, Clear Water Bay, Hong Kong, Peoples R China;

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