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The impact of thickness and thermal annealing on refractive index for aluminum oxide thin films deposited by atomic layer deposition

机译:厚度和热退火对原子层沉积氧化铝薄膜折射率的影响

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摘要

The aluminum oxide (Al2O3) thin films with various thicknesses under 50 nm were deposited by atomic layer deposition (ALD) on silicon substrate. The surface topography investigated by atomic force microscopy (AFM) revealed that the samples were smooth and crack-free. The ellipsometric spectra of Al2O3 thin films were measured and analyzed before and after annealing in nitrogen condition in the wavelength range from 250 to 1,000 nm, respectively. The refractive index of Al2O3 thin films was described by Cauchy model and the ellipsometric spectra data were fitted to a five-medium model consisting of Si substrate/SiO2 layer/Al2O3 layer/surface roughness/air ambient structure. It is found that the refractive index of Al2O3 thin films decrease with increasing film thickness and the changing trend revised after annealing. The phenomenon is believed to arise from the mechanical stress in ALD-Al2O3 thin films. A thickness transition is also found by transmission electron microscopy (TEM) and SE after 900°C annealing.
机译:通过原子层沉积(ALD)在硅基板上沉积厚度小于50 nm的氧化铝(Al2O3)薄膜。通过原子力显微镜(AFM)研究的表面形貌表明,样品光滑且无裂纹。在氮气条件下分别在250至1,000nm波长范围内进行退火前后,分别测量和分析了Al2O3薄膜的椭圆光谱。用柯西模型描述了Al2O3薄膜的折射率,并将椭偏光谱数据拟合到由Si衬底/ SiO2层/ Al2O3层/表面粗糙度/空气周围结构组成的五介质模型。发现Al2O3薄膜的折射率随膜厚的增加而降低,并且退火后其变化趋势得到修正。据信该现象是由于ALD-Al 2 O 3薄膜中的机械应力引起的。在900°C退火后,还可以通过透射电子显微镜(TEM)和SE发现厚度变化。

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