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Dielectric Breakdown and Post-Breakdown Dissolution of Si/SiO2 Cathodes in Acidic Aqueous Electrochemical Environment

机译:酸性水电化学环境中Si / SiO2阴极的介电击穿和击穿后溶解

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摘要

Understanding the conducting mechanisms of dielectric materials under various conditions is of increasing importance. Here, we report the dielectric breakdown (DB) and post-breakdown mechanism of Si/SiO2, a widely used semiconductor and dielectric, in an acidic aqueous electrochemical environment. Cathodic breakdown was found to generate conduction spots on the Si/SiO2 surface. Using scanning electrochemical microscopy (SECM), the size and number of conduction spots are confirmed to increase from nanometer to micrometer scale during the application of negative voltage. The morphologies of these conduction spots reveal locally recessed inverted-pyramidal structures with exposed Si{111} sidewalls. The pits generation preceded by DB is considered to occur via cathodic dissolution of Si and exfoliation of SiO2 that are induced by local pH increases due to the hydrogen evolution reaction (HER) at the conduction spots. The HER at the conduction spots is more sluggish due to strongly hydrogen-terminated Si{111} surfaces.
机译:了解电介质材料在各种条件下的导电机理变得越来越重要。在这里,我们报告了在酸性水性电化学环境中Si / SiO2(一种广泛使用的半导体和电介质)的介电击穿(DB)和击穿后机理。发现阴极击穿会在Si / SiO2表面上产生导电点。使用扫描电化学显微镜(SECM),可以确定在施加负电压期间,导电点的大小和数量从纳米级增加到微米级。这些导电点的形态揭示了局部凹陷的倒金字塔形结构,具有暴露的Si {111}侧壁。 DB之前的凹坑产生被认为是由于Si的阴极溶解和SiO2的剥落而发生的,这是由于导电点处的析氢反应(HER)引起的局部pH值升高引起的。由于强氢封端的Si {111}表面,传导点处的HER更缓慢。

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