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A Molecular Dynamics Study of Crosslinked Phthalonitrile Polymers: The Effect of Crosslink Density on Thermomechanical and Dielectric Properties

机译:交联邻苯二甲腈聚合物的分子动力学研究:交联密度对热机械和介电性能的影响

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摘要

In this work, molecular dynamics (MD) and molecular mechanics (MM) simulations are used to study well-equilibrated models of 4,4′-bis(3,4-dicyanophenoxy)biphenyl (BPh)–1,3-bis(3-aminophenoxy)benzene (m-APB) phthalonitrile (PN) system with a range of crosslink densities. A cross-linking technique is introduced to build a series of systems with different crosslink densities; several key properties of this material, including thermal expansion, mechanical properties and dielectric properties are studied and compared with experimental results. It is found that the coefficient of linear thermal expansion predicted by the model is in good agreement with experimental results and indicative of the good thermal stability of the PN polymeric system. The simulation also shows that this polymer has excellent mechanical property, whose strength increases with increasing crosslink density. Lastly and most importantly, the calculated dielectric constant—which shows that this polymer is an excellent insulating material—indicates that there is an inverse relation between cross-linking density and dielectric constant. The trend gave rise to an empirical quadratic function which can be used to predict the limits of attainable dielectric constant for highly crosslinked polymer systems. The current computational work provides strong evidence that this polymer is a promising material for aerospace applications and offers guidance for experimental studies of the effect of cross-linking density on the thermal, mechanical and dielectric properties of the material.
机译:在这项工作中,分子动力学(MD)和分子力学(MM)模拟被用来研究4,4'-双(3,4-二氰基苯氧基)联苯(BPh)–1,3-bis(3)的平衡模型-氨基苯氧基)苯(m-APB)邻苯二甲腈(PN)系统,具有各种交联密度。引入交联技术以构建一系列具有不同交联密度的系统。研究了这种材料的几个关键性能,包括热膨胀,机械性能和介电性能,并与实验结果进行了比较。发现该模型预测的线性热膨胀系数与实验结果高度吻合,并且表明PN聚合物体系具有良好的热稳定性。模拟还表明该聚合物具有优异的机械性能,其强度随交联密度的增加而增加。最后也是最重要的一点是,计算出的介电常数(表明该聚合物是极好的绝缘材料)表明交联密度与介电常数之间存在反比关系。这种趋势引起了经验的二次函数,该函数可以用来预测高度交联的聚合物体系可达到的介电常数的极限。当前的计算工作提供了有力的证据,证明这种聚合物是航空航天应用中的一种有前途的材料,并为交联密度对材料的热,机械和介电性能的影响进行实验研究提供了指导。

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