首页> 美国卫生研究院文献>Nanomaterials >Synthesis of Nitrogen-Doped Graphene on Copper Nanowires for Efficient Thermal Conductivity and Stability by Using Conventional Thermal Chemical Vapor Deposition
【2h】

Synthesis of Nitrogen-Doped Graphene on Copper Nanowires for Efficient Thermal Conductivity and Stability by Using Conventional Thermal Chemical Vapor Deposition

机译:常规热化学气相沉积法在铜纳米线上合成氮掺杂石墨烯以提高热导率和稳定性

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

Cu nanowires (NWs) possess remarkable potential a slow-cost heat transfer material in modern electronic devices. However, Cu NWs with high aspect ratios undergo surface oxidation, resulting in performance degradation. A growth temperature of approximately <1000 °C is required for preventing the changing of Cu NW morphology by the melting of Cu NWs at over 1000 °C. In addition, nitrogen (N)-doped carbon materials coated on Cu NWs need the formation hindrance of oxides and high thermal conductivity of Cu NWs. Therefore, we investigated the N-doped graphene-coated Cu NWs (NG/Cu NWs) to enhance both the thermal conductivity and oxidation stability of Cu NWs. The Cu NWs were synthesized through an aqueous method, and ethylenediamine with an amine group induced the isotropic growth of Cu to produce Cu NWs. At that time, the amine group could be used as a growth source for the N-doped graphene on Cu NWs. To grow an N-doped graphene without changing the morphology of Cu NWs, we report a double-zone growth process at a low growth temperature of approximately 600 °C. Thermal-interface material measurements were conducted on the NG/Cu NWs to confirm their applicability as heat transfer materials. Our results show that the synthesis technology of N-doped graphene on Cu NWs could promote future research and applications of thermal interface materials in air-stable flexible electronic devices.
机译:铜纳米线(NWs)具有惊人的潜力,是现代电子设备中成本低廉的传热材料。然而,具有高纵横比的Cu NWs会发生表面氧化,从而导致性能下降。需要大约<1000°C的生长温度,以防止由于超过1000°C的Cu NW的熔化而导致Cu NW形态的变化。另外,涂覆在Cu NWs上的氮(N)掺杂碳材料需要氧化物的形成障碍和Cu NWs的高热导率。因此,我们研究了氮掺杂石墨烯包覆的铜纳米线(NG / Cu NWs),以提高铜纳米线的导热性和氧化稳定性。通过水法合成Cu NWs,带有胺基的乙二胺诱导Cu各向同性生长,从而生成Cu NWs。那时,胺基可以用作Cu NWs上N掺杂石墨烯的生长源。为了在不改变Cu NWs形态的情况下生长N掺杂石墨烯,我们报道了在大约600°C的低生长温度下的双区生长过程。对NG / Cu NW进行热界面材料测量,以确认其作为传热材料的适用性。我们的结果表明,在NWs上合成N掺杂石墨烯可以促进热界面材料在空气稳定的柔性电子器件中的研究和应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号