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Electric Characteristic Enhancement of an AZO/Si Schottky Barrier Diode with Hydrogen Plasma Surface Treatment and AlxOx Guard Ring Structure

机译:氢等离子体表面处理和AlxOx保护环结构增强AZO / Si肖特基势垒二极管的电特性

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摘要

In this study, the design and fabrication of AZO-Si Schottky barrier diodes (SBDs) with hydrogen plasma treatment on silicon surface and AlxOx guard ring were presented. The Si surface exhibited less interface defects after the cleaning process following with 30 w of H2 plasma treatment that improved the switching properties of the following formed SBDs. The rapid thermal annealing experiment also held at 400 °C to enhance the breakdown voltage of SBDs. The edge effect of the SBDs was also suppressed with the AlxOx guard ring structure deposited by the atomic layer deposition (ALD) at the side of the SBDs. Experimental results show that the reverse leakage current was reduced and the breakdown voltage increased with an addition of the AlxOx guard ring. The diode and fabrication technology developed in the study were applicable to the realization of SBDs with a high breakdown voltage (>200 V), a low reverse leakage current density (≤72 μA/mm2@100 V), and a Schottky barrier height of 1.074 eV.
机译:在这项研究中,提出了在硅表面和AlxOx保护环上进行氢等离子体处理的AZO / n-Si肖特基势垒二极管(SBD)的设计和制造。在经过30 w的H2等离子体处理之后的清洁工艺之后,Si表面的界面缺陷更少,从而改善了随后形成的SBD的开关性能。快速热退火实验还保持在400°C,以提高SBD的击穿电压。通过在SBD侧面的原子层沉积(ALD)沉积的AlxOx保护环结构,也可以抑制SBD的边缘效应。实验结果表明,通过添加AlxOx保护环,可以减小反向漏电流,并提高击穿电压。研究中开发的二极管和制造技术适用于高击穿电压(> 200 V),反向漏电流密度低(≤72μA/ mm 2 @ 100 V)的SBD的实现)和1.074 eV的肖特基势垒高度。

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