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Wear Behavior and Microstructure of Mg-Sn Alloy Processed by Equal Channel Angular Extrusion

机译:等通道角挤压Mg-Sn合金的磨损行为与组织

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摘要

Mg-5wt.% Sn alloy is often used in portable electronic devices and automobiles. In this study, mechanical properties of Mg-5wt.% Sn alloy processed by Equal Channel Angular Extrusion (ECAE) were characterized. More precisely, its hardness and wear behavior were measured using Vickers hardness test and a pin-on-disc wear test. The microstructures of ECAE-processed Mg-Sn alloys were investigated by scanning electron microscope and X-ray diffraction. ECAE process refined the grain sizes of the Mg-Sn alloy from 117.6 μm (as-cast) to 88.0 μm (one pass), 49.5 μm (two passes) and 24.4 μm (four passes), respectively. Meanwhile, the hardness of the alloy improved significantly. The maximum wear resistance achieved in the present work was around 73.77 m/mm3, which was obtained from the Mg-Sn alloy treated with a one-pass ECAE process with a grain size of 88.0 μm. The wear resistance improvement was caused by the grain size refinement and the precipitate of the second phase, Mg2Sn against the oxidation of the processed alloy. The as-cast Mg-Sn alloy with the larger grain size, i.e., 117.6 μm, underwent wear mechanisms, mainly adhesive wear and abrasive wear. In ECAE-processed Mg-Sn alloy, high internal energy occurred due to the high dislocation density and the stress field produced by the plastic deformation, which led to an increased oxidation rate of the processed alloy during sliding. Therefore, the oxidative wear and a three-body abrasive wear in which the oxide debris acted as the three-body abrasive components became the dominant factors in the wear behavior, and as a result, reduced the wear resistance in the multi-pass ECAE-processed alloy.
机译:Mg-5wt。%Sn合金通常用于便携式电子设备和汽车中。在这项研究中,表征了通过等通道角挤压(ECAE)加工的Mg-5wt。%Sn合金的力学性能。更精确地,其硬度和磨损行为是使用维氏硬度测试和针盘式磨损测试测量的。通过扫描电子显微镜和X射线衍射研究了ECAE处理的Mg-Sn合金的显微组织。 ECAE工艺将Mg-Sn合金的晶粒尺寸从117.6μm(铸态)精炼为88.0μm(一道次),49.5μm(两道次)和24.4μm(四道次)。同时,合金的硬度显着提高。本工作中获得的最大耐磨性约为73.77 m / mm 3 ,这是通过采用一次ECAE工艺处理的Mg-Sn合金获得的,其晶粒尺寸为88.0μm。耐磨性的提高是由于晶粒尺寸的细化和第二相Mg2Sn的析出与加工合金的氧化有关。具有较大晶粒尺寸(即117.6μm)的铸态Mg-Sn合金经历了磨损机制,主要是粘合剂磨损和磨料磨损。在ECAE处理的Mg-Sn合金中,由于高的位错密度和塑性变形产生的应力场,产生了较高的内能,从而导致处理的合金在滑动过程中的氧化速率增加。因此,氧化磨损和三体磨料磨损(其中氧化物碎屑充当三体磨料成分)成为磨损行为的主要因素,结果,降低了多道次ECAE-加工合金。

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