利用铜试剂与Cu2+生成黄棕色络合物的特效显色反应,用分光光度法测定镀镍溶液中的铜杂质.用EDTA掩蔽镍离子和铁离子,在氨碱性条件下显色,显色液pH≈9.2.以镀液底色作参比,在λ=450 nm处测定.实验表明,测定结果的相对平均偏差为2%,能够满足监控镀镍溶液中铜杂质的要求.%The copper impurity in nickel plating bath was determined with spectrophotometry by using the speciality that DDTC reacts with Cu2+ ion to form yellow-brown complex. This reaction occurred by Ni2 + and Fe2+ ions masked with EDTA and under an ammoniac condition of pH ≈9.2. The determination was carried out at wavelength 450 nm with nickel plating solution as reference solution. The results show that the relative average deviation of this method is 2％. And this analysis method can satisfy the requirement of copper impurity monitoring and controlling in nickel plating bath.
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