化学镀镍规律及机理探讨

摘要

基于化学反应所遵循的物质守恒原理,在已知主要反应物、生成物条件下,利用化学方程式配平法,探讨了不同条件下化学镀镍的基本规律,首次提出了与目前经典化学镀镍理论不同的反应方程式；在此基础上找出了次磷酸利用率规律；利用P-H键断裂理论分析探讨了化学镀镍溶液成分及工艺条件,如稳定剂、pH、装载量、加速剂及络合剂等对化学镀镍的影响机理；总结提出了提高化学镀镍速度的措施.%With the known reactant and resultant, the basic mechanism on electroless nickel plating under different conditions was discussed by using chemical equations based on the law of mass conservation. The new reaction equation different from classic theory of electroless nickel plating was proposed. And then the efficiency behavior of sodium pypophosphite was found. The effect of electrolyte composition and plating parameters such as stabilizer, pH value, loadage, promoter and complexing agent on the mechanism was discussed by P-H chemical bond breaking theory. Finally the solutions on improving the rate of nickel plating were put forward.