硅表面化学镀镍研究

摘要

Electroless nickel(Ni) possesses excellent characteristics,which could be widely used as surface protective coating of plastics,semiconductor and metal,and among which,Electroless Ni on the silicon surface semiconductor has been made a thorough research.In this work,the primary results and progress of electroless Ni on the silicon substrate surface is introduced in detail,mainly including the pretreatment methods and electroless Ni process technology on silicon substrate surface,the chemical reaction mechanism of electroless Ni on the silicon substrate surface.And the influence of additives on the electroless Ni was also studied.And the future development trend of electroless Ni on the silicon substrate surface was summarized and predicted.%化学镀镍具有优异的特性,广泛应用于塑料、半导体和金属的表面保护涂层,其中半导体硅表面化学镀镍已有深入的研究.针对硅基体表面化学镀镍的研究进展和成果进行了详细介绍,主要包括硅基体表面的预处理方法、化学镀镍工艺,硅基体表面化学镀镍的反应机理和添加剂对化学镀镍的影响研究,并总结展望了硅基体表面化学镀镍的发展趋势.