The rapid development of wireless communications worldwide results in a huge demand forminiaturized antenna with excellent performance to send and receive wireless signals to and from com-munication devices. Microstrip patch antennas are used in a variety of applications for their salient fea-tures. By sandwiching a layer of Teflon between the silicon wafer and the ground plane, the novel mi-cromachined shortened stacked patch antenna printed on high-index wafer has superior performance o-ver those of traditional design, while its bandwidth has been increased by as much as 8.6 %, and itslength of patch has been miniaturized to only an eighth wavelength. The radiation patterns show thateven if the antenna is on a ground plane of approximately the size of a handset phone circuit board,most of the radiation is directed away from the user's head, and the wide beamwidth can ensure wideangular coverage. The antenna micromachined in a silicon wafer can also be integrated with Si andGaAs IC without affecting any of the circuit requirements.%近年来无线通信在全球范围内得到了迅猛的发展,对收发无线信号的天线尺寸的小型化和性能要求也在日益增加.微带贴片天线以其卓越的性能,得到了广泛应用.传统的半波天线尺寸较大,在小型通信设备中使用会出现许多问题.本文提出了一种在高介电常数上用微机械工艺制作的短接层叠式贴片天线,该天线在硅片和接地板间夹一层Tef-lon(聚四氟乙烯),这样天线的性能得到了提升,相对带宽增加到8.6%,而几何尺寸仅为波长的1/8.天线的测试方向图表明,天线靠近手机电路板时,大部分的电磁辐射会远离使用者的头部,且波束宽度可保证足够大的覆盖范围.此天线是在硅片上进行微机械加工的,可与硅和GaAs集成电路集成在一起,而不会影响电路本身.此天线可适用于移动通信设备.
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