光子晶体光纤端面研磨损伤的分析

摘要

对光子晶体光纤的端面研磨过程进行研究,讨论了光子晶体光纤端面研磨损伤的特点.针对光子晶体光纤的结构特点,应用有限元法建立了数值仿真模型.通过单一磨粒切削孔壁的仿真实验,分析了不同切削深度下裂纹损伤的产生情况以及不同磨粒直径对光纤孔壁结构造成的损伤.最后通过实际研磨实验验证了分析结果.结果表明:有限元法能够很好地模拟光子晶体光纤的端面研磨过程;研磨过程中,相对于非孔洞区域,孔壁边缘更容易出现损伤,呈现出沿圆周分布的崩塌区域;边缘崩塌区域尺寸随磨粒直径的增加而增加.实验用光子晶体光纤孔壁边缘无崩塌的最大切削深度低于普通光纤脆塑转变的临界切削深度,使用0.02μm的砂纸进行抛光可以有效地避免对光子晶体光纤孔壁造成损伤.%The lapping process for photonic crystal fibers (PCFs ) was studied , and the end face damage of the PCFs was discussed .Based on the structure characteristics of the PCFs ,a digital simulation model was established by finite element method . Through the simulation of a single grinding hole wall ,the occurrence of crack damage under different cutting depths and the effect of damage caused by different grinding grain diameters on the structure of fiber hole wall were analyzed . Finally ,the analysis results were verified by the PCF end face lapping experiments .The results show that FEM can effectively simulate the end face lapping process of PCF .As compared to the non hole region ,the edge of hole wall is more prone to damage in the lapping process ,showing a collapse area distributed along the circumference .The size of collapse area increases with the grit diameter .For no collapse area generation ,the maximum cutting depth of this PCF is less than the critical cutting depth of brittle plastic transition of ordinary fiber and the abrasive paper with a thickness of 0 .02 μm can be used to polish to avoid the damage on the PCF hole wall .