聚砜/半芳族热致液晶聚合物原位复合材料的形态及性能

摘要

In order to improve the processing ability of Polysulfone(PSU) without losing its excellent mechanical and thermal properties, a semiaromatic polyester (exhibiting thermotropic liquid crystalline property in 225～340℃) was used to blend with PSU. The thermal properties, rheology, morphology and mechanical properties of various blends having different ratios were investigated. When the loading level of the semiaromatic polyester is about 5%～10% by weight, the blends exhibit lower viscosity, better mechanical properties. But the components of the blends are incompatible, blending high amount of the polyester to PSU make its properties decrease.%向聚砜（PSF）中加入5％可原位成纤的半芳族热致液晶聚合物（TLCP1），原位复合材料的表观粘度同PSF相比有明显降低，聚砜的加工性得到明显改进，同时复合材料的拉伸强度、弯曲强度、拉伸模量、弯曲模量均有所提高。形态研究表明：在TLCP含量为5%～30％范围内TLCP1均可在基体中分散并形成具有一定长径比的微纤。当TLCP1用量高于10％时，原位复合体系呈现明显的皮-芯形态，抗拉及抗弯曲性能发生劣化，但模量显著增加。