塑封电子元器件温度失效机理研究

摘要

Failure analysis of plastic encapsulated microcircuit in temperature recycle test was carried out by using non-destructive technique and destructive microscopy analysis technique. The development of defects was studied. Suggestions were put forward on improvement of device design and existing standards.%应用非破坏性检测技术和破坏性显微分析技术对塑封电子元器件在温度循环试验中发生的失效进行了分析，通过研究缺陷发展的过程并结合现有检测标准要求，提出了对器件设计改进和完善现有检测标准的建议。