印制线路板上硫氰酸亚金钾体系化学镀金

摘要

Electroless gold plating was conducted on the surface of nickel-plated printed circuit board using potassium gold(Ⅰ) thiocyanate [KAu(SCN)2] as main salt.The effects of Au+ and ammonium thiocyanate contents,as well as pH and temperature of the bath on deposition rate,appearance and adhesion of gold coating were studied by single-factor experiment.The optimal bath composition and process parameters were obtained as follows:Au+ 2.0 g/L,ammonium thiocyanate 15 g/L,additive Cy-808 150 mL/L,temperature 50 ℃,and pH 3.0.The gold deposition rate under the given process conditions is ca.6 nm/min.The obtained gold coating is uniform,compact,bright and golden yellow.%以硫氰酸亚金钾[KAu(SCN)2]为金源对镀镍印制线路板进行化学镀金.采用单因素试验研究了镀液中Au+含量、硫氰酸铵含量、pH和温度对沉金速率、金层外观和结合力的影响,得到最优配方和工艺参数为:Au+ 2.0 g/L,硫氰酸铵15 g/L,添加剂Cy-808 150 mL/L,pH 3.0,温度50℃.在此条件下沉金速率约为6nm/min,结晶均匀细致,呈光亮的金黄色.