Rosin-based polyamide used as curing agent for conductive adhesive, was prepared from maleopimaric acid anhydride by amidation with diethylenetriamine, with epoxy resin 618 as matrix,silver-coated copper powder as conductive filler, KH560 and PEG ( 200 ) as accelerant, and silver-coated copper powder conductive adhesive was prepared. The influences of various factors on the shear strength, conductivity of the conductive adhesive were discussed, and its glass transition and heat-resistance were evaluated. The result showed that the resin epoxy/rosin-based polyamide system was cured completely when the mass ratio of resin epoxy: rosin-based polyamide was 100: 50.8 at 120 ℃ for 60 min, and the addition of silver-coated copper powder was 60％ to resin epoxy, KH560 and PEG ( 200 ) were 3％ and 5％ to silver-coated copper powder respectively. Under such conditions the comprehensive performance of the conductive adhesive was optimal. Thermal decomposition temperature was 342.1 ℃, and glass transition was 144.7 ℃.%以马来海松酸酐、二乙烯三胺为原料,合成了松香基聚酰胺,并以其为固化剂,以环氧树脂618为导电胶基体,Ag包Cu粉为导电胶填料,KH560、聚乙二醇(200)为促进剂,制备了Ag包Cu粉导电胶,讨论了各因素对导电胶剪切强度、导电性能的影响,并测定了导电胶的玻璃化温度及耐热性能.结果表明,环氧树脂与松香基聚酰胺在固化质量比为100:50.8、120 ℃/60 min条件下可完全固化;Ag包Cu粉的添加量为环氧树脂质量的60%、KH560、聚乙二醇添加量分别为Ag包Cu粉质量的3%、5%时,导电胶的综合性能最优,此时,导电胶的热分解温度为342.1℃,玻璃化温度为144.7℃.
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