提出了一种丙烯腈-丁二烯-苯乙烯(ABS)塑料化学镀铜激光无钯活化新工艺.对塑料基体进行预处理,然后放入以硫酸铜与次磷酸钠混合配制的活化液中30min,取出干燥,塑料基体表面形成一层活化层;用激光均匀扫描基体表面,活化层中铜离子在激光作用下被次磷酸根离子还原为具有催化活性的铜微粒.研究了活化液配比和激光参数对活化效果的影响,采用正交试验优化了各项参数,通过扫描电镜观察镀层微观形貌,并对激光活化后的基体进行了能谱分析,采用高低温冲击法检测镀层结合性.结果表明,当硫酸铜与次磷酸钠的浓度分别为10g/L和30g/L、激光光斑直径为2mm、扫描速率为2.2mm/s时,镀层完全覆盖基体,基体活化后表面生成一层均匀的铜微粒,镀层表面微观结构紧凑,结合性较好.%A new palladium-free activation technology for ABS plastic electroless copper plating is proposed. The plastic substrate is pretreated, and then placed in an activating solution prepared by mixing copper sulfate and sodium hypophosphite for 30 minutes. The plastic substrate is dried to form an activation layer at the surface, which is then uniformly scanned with a laser to allow the hypophosphite ions to be reduced into catalytically active copper particles. The effects of the formation of the activating solution and the laser parameters on the activation are studied. The parameters are optimized by using the orthogonal test. The microstructure of the coating is observed by scanning electron microscope. The energy spectrum of the substrate after laser activation is analyzed. Impact test is processed for coating binding detection. The results show that when the concentrations of copper sulphate and sodium hypophosphite are 10g/L and 30g/L respectively, and the laser spot diameter is 2mm and the scanning rate is 2.2mm/s, the coating completely covers the substrate and the surface of the substrate is uniformly coated with copper particles, showing compact microstructure and good binding.
展开▼
