A rapid failure assessment approach for insertion mount solder interconnects under thermo-mechanical cycling.

摘要

During use, insertion mounted solder joints can be subjected to a variety of loading conditions that can lead to failure. The intention of this dissertation is to demonstrate relationships between applied thermal environment and the associated life cycle of the insertion mount systems by using sophisticated analytical simulations and associated life predictive analyses. In order to achieve the objective, a rapid approach was developed for calculating loads at critical locations of an insertion-mounted structure subjected to cyclic thermomechanical loading. The analytical calculation of stresses from the elastic foundation theory and concentric cylinder theory were also used in an iterative creep process. The analytical solution of the insertion mount systems permitted the examination of the multiaxial fatigue behavior at critical locations for peripheral and area array packages experiencing thermomechanical loading. Comparisons were made with ANSYS finite-element analysis software, experimental results, and field results.