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Thermal protection of an inductive proximity sensor utilizing low-density ceramic composition tile.

机译:利用低密度陶瓷合成砖的电感式接近传感器的热保护。

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摘要

This thesis presents the results of a unique method for protecting inductive proximity (IP) sensors from extreme thermal exposure. The method presented in this study employs a barrier of ceramic tile material developed for the space shuttle program. While it may be intuitive that the ceramic tile material will provide adequate protection for extreme temperatures, what is not clear is the adaptability of this material to commercial use in a steel mill environment.;One of the potential problems associated with using any thermal barrier is a partial or complete attenuation of the magnetic field generated by the sensor. To effectively utilize the shielding material in an application such as this it is necessary to understand the effect of the ceramic material on the magnetic field generated by the proximity sensor.;In order to test the effectiveness of the ceramic tile to provide the level of thermal protection required and to discover if the tile will allow adequate magnetic field penetration for sensor detection, a series of two separate tests will be run. The first test will verify that the thermal shielding properties maintain the cool side temperature within the operational threshold of the sensor; the second test will establish the maximum sensing distance with the ceramic tile interposed between the sensor and the detectable object. This study determines if it is possible to consistently detect piping of 4" nominal diameter carbon steel pipe at a minimum specified distance from the shielding assembly.
机译:本文提出了一种独特的方法来保护电感式接近(IP)传感器免于极端热暴露的结果。本研究中介绍的方法采用了为航天飞机计划开发的瓷砖材料阻隔层。虽然直觉上说瓷砖材料可以为极端温度提供足够的保护,但尚不清楚该材料是否适合钢厂环境中的商业用途。;与任何隔热层相关的潜在问题之一是传感器产生的磁场的部分或全部衰减。为了在诸如此类的应用中有效地使用屏蔽材料,必须了解陶瓷材料对接近传感器产生的磁场的影响。为了测试瓷砖提供热能水平的有效性进行必要的保护并发现瓷砖是否将允许足够的磁场穿透以进行传感器检测,将运行一系列两个单独的测试。第一个测试将验证热屏蔽性能将冷侧温度保持在传感器的操作阈值内;第二项测试将建立最大感应距离,并在传感器和可检测物体之间插入瓷砖。这项研究确定了是否有可能在距屏蔽组件的最小指定距离处连续检测公称直径为4英寸的碳钢管的管道。

著录项

  • 作者

    Anger, Kim.;

  • 作者单位

    Indiana State University.;

  • 授予单位 Indiana State University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 M.S.
  • 年度 2010
  • 页码 38 p.
  • 总页数 38
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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