Additive pattern transfer techniques for the post-IC integration of metallic MEMS onto active circuits.

摘要

Integration of MEMS onto microelectronics is of great interest in the MEMS research community because it has huge potential for intelligent integrated micro devices/systems to provide enhanced performance, increased functionality and reliability with potentially low cost. In this thesis, additive pattern transfer techniques including SU-8 UV-LIGA, PDMS replication, and electroplating-based flip-chip bonding processes were developed. Those developed processes were used to demonstrate the post-IC integration capability of metallic MEMS onto foundry fabricated CMOS chips. LIGA MEMS and MEMS inductors using PDMS electroplating molds were transferred onto CMOS chips. Using multi-layer SU-8 UV-LIGA process, air-suspended MEMS inductors were designed and integrated onto RE circuit chips and such integrated inductors showed excellent RE characteristics. Sub-micron featured metallic comb-drive electrodes were fabricated using EBL-based nanomachining process.