Relative adhesion measurement for thin film microelectronic structures. Part Ⅱ

摘要

The present discussion on the relative adhesion measurement for thin film microelectronic structures will emphasize experimental results on the two adhesion test methods compared: the peel test and the modified edge lift-off test (MELT). The data presented show that the fracture behaviour in the modified edge lift-off test can be significantly more complex than what is detected in the peel test, and further emphasizes the importance of careful locus of failure analyses. A comparison of present results with the published literature underlines the fact that it is impossibile to determine the fundamental adhesion using a practical adhesion test. This is due to the inability to account for all energy dissipating processes during the testing. The peel test, however, can result in reliable practical adhesion measurement. MELT needs more characterization and possibly modification in sample preparation before the same can be said of this new test method.