Improvement and testing of diamond film adhesion

摘要

Thin diamond films were deposited by the CVD method onto Cu/TiC layer sputter deposited on Si(111) and steel substrates. Film characterizations by X-ray, SEM and Raman spectros-copy were carried out. Tensile test as well as surface indentation were used to determine the film adhesion strength on the substrates. It is important to make sure that the fracture during the tensile test occurs only at the interface between the diamond film and the substrate to obtain quantitative results on film adhesion strength. The results indicate that the Cu/TiC sputtered intermediate layer plays an important role not only in promoting diamond nucleation but also in diamond film adhesion strength to these substrates.