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Influence of Electron Incident Angle Distribution on CD-SEM Linewidth Measurements

机译:电子入射角分布对CD-SEM线宽测量的影响

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The linewidth measurement ability of the Model-Based Library (MBL) matching technique is evaluated by a simulation study, and an improvement in the technique is proposed. In this study, a focused electron beam model is introduced in the MONSEL Monte Carlo simulator to estimate the effects of the electron incident angle distribution on linewidth measurements. By using the focused electron beam model, the images that will be obtained by an actual critical-dimension scanning electron microscope (CD-SEM) were simulated. Measurements were carried out on the images which would be taken with the SEM focus conditions in a range maintained by the auto-focus system. As a result of measurements of simulated images with various sample geometries, it was confirmed that the current MBL matching with a simple Gaussian electron beam model could cause a measurement error of more than 3 nm for the linewidth and 2° for the sidewall angle. Since the incident angle distribution distorts the effective beam shape and image profile at the edge of a pattern, conventional MBL matching with a simple Gaussian beam model cannot give a proper measurement of sample geometry for the image profile formed by the focused electron beam, and this results in measurement errors. To eliminate these measurement errors, another library produced by the focused electron beam model, is employed for the MBL matching. The new library consists of simulated profiles at only the best focus, and it enables the MBL to use a better model and to achieve accurate measurements without increased computational costs. By using the new library, measurement errors are reduced to 0.6nm for the linewidth and to 0.2° for the sidewall angle.
机译:通过仿真研究评估了基于模型的库(MBL)匹配技术的线宽测量能力,并提出了对该技术的改进。在这项研究中,在MONSEL蒙特卡洛模拟器中引入了聚焦电子束模型,以估计电子入射角分布对线宽测量的影响。通过使用聚焦电子束模型,模拟了将由实际的临界尺寸扫描电子显微镜(CD-SEM)获得的图像。在将由自动聚焦系统保持的范围内的SEM聚焦条件下拍摄的图像上进行测量。作为对具有各种样品几何形状的模拟图像进行测量的结果,可以证实,当前的MBL与简单的高斯电子束模型匹配可能导致线宽的测量误差大于3 nm,侧壁角的测量误差大于2°。由于入射角分布会扭曲图案边缘的有效电子束形状和图像轮廓,因此传统的MBL与简单的高斯束模型匹配无法为聚焦电子束形成的图像轮廓提供样品几何形状的正确测量。导致测量错误。为了消除这些测量误差,将聚焦电子束模型产生的另一个库用于MBL匹配。新的库仅包含最关注的模拟配置文件,它使MBL可以使用更好的模型并实现准确的测量而不会增加计算成本。通过使用新的库,线宽的测量误差降低到0.6nm,侧壁角的测量误差降低到0.2°。

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