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Dynamic Recrystallization Behavior of GH4586 Superalloy during Hot Compression

机译:GH4586高温合金在热压缩过程中的动态再结晶行为

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Compression test for GH4586 superalloy was carried out at 1273 K and 1373 K with stain from 20% to 60%. The characteristics of dynamic recrystallization were investigated by confocal laser scanning microscope, TEM and EBSD. It was found that at 1273 K dynamic recrystallization mainly took place along preexisting grain boundaries creating a necklace structure. It was confirmed by TEM observations that the first layer of the necklace structure was formed by the mechanism of bulging of substructure boundaries and the following layers were nucleated at the triple junctions of former dynamic recrystallization grains. When specimens were deformed with different strains at 1373 K, dynamic recrystallization was almost completed. Our observation showed that twinning played an important role during dynamic recrystallization by promoting dynamic recrystallization grains growing. Substructures of grains were constructed by the reconfiguration of dislocations hindered at large γ' particles in interior of initial grains during dynamic recovery.
机译:GH4586高温合金的压缩试验以1273K和1373K进行,污渍为20%至60%。通过共聚焦激光扫描显微镜,TEM和EBSD研究了动态再结晶的特性。发现,在1273K动态重结晶时,主要发生沿着预先存在的晶界形成项链结构。通过TEM观察确认,即通过凸出边界的凸出机理形成项链结构的第一层形成,并且在前动态再结晶晶粒的三倍转处核化下列层。当样品在1373k k的不同菌株中变形时,几乎完成了动态再结晶。我们的观察结果表明,通过促进动态再结晶粒度生长,Twinning在动态再结晶期间发挥了重要作用。通过在动态恢复期间在初始颗粒内部的大γ'颗粒处于大γ'颗粒的脱位来构建晶粒的副结构。

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