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Reduction in Lags and Current Collapse in Field-Plate AlGaN/GaN HEMTs with High Acceptor Density in a Buffer Layer

机译:缓冲层中受体密度高的场板AlGaN / GaN HEMT中的滞后现象和电流崩塌的减少

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We make a two-dimensional transient analysis of field-plate AlGaN/GaN HEMTs with a semi-insulating buffer layer, where a deep acceptor above the midgap is considered. It is studied how the deep-acceptor density NDA and the field plate affect buffer-related lag phenomena and current collapse. NDA is varied between 1017 cm~(-3) and 8x10~(17) cm~(-3). It is shown that without a field plate the drain lag and current collapse increase with increasing N_(DA) as expected, although the gate lag decreases when N_(DA) becomes higher than 2x10~(17) cm~(-3). But with a field plate, surprisingly, the lags and current collapse decrease when N_(DA) becomes high. This is attributed to the fact that the reduction in drain lag and current collapse by introducing a field plate becomes more significant when N_(DA) becomes higher.
机译:我们对具有半绝缘缓冲层的场板AlGaN / GaN HEMT进行了二维瞬态分析,其中考虑了中间隙上方的深受体。研究了深受体密度NDA和场板如何影响与缓冲有关的滞后现象和电流崩塌。 NDA在1017 cm〜(-3)和8x10〜(17)cm〜(-3)之间变化。结果表明,在没有场板的情况下,漏极延迟和电流崩塌会随着N_(DA)的增加而增加,尽管栅极延迟会在N_(DA)高于2x10〜(17)cm〜(-3)时降低。但令人惊讶的是,对于场板,当N_(DA)变高时,滞后和电流崩塌减小。这归因于以下事实:当N_(DA)变高时,通过引入场板而导致的漏极滞后和电流崩溃的减小变得更加显着。

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