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Diffusion in solids with holographic interferometry

机译:全息干涉法在固体中的扩散

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Abstract: It is of great importance for the formation of p-n junction in semiconductors by penetrating some impurities through the depth near the surface, so it has long been paid attention to control the concentration distribution of impurities during the diffusion process. In recent years, ionic carburizing, and ion bombardment penetration etc. for the treatment of metal surface have also attracted by material sciences. It requires that the diffusion depth and the diffusion time of the impurities should be under precise control. Different methods, such as the method of radioisotopic detection and the method of chemical analysis have been adopted, however, the reports of different workers are very different, especially in the real time measurement, so, finding new method is never ending. In 1984, H. Fenichel have performed experiments on the solutions of table salt and sugar with the method of holographic interferometry. As for metals which are opaque for the visible light, but they become transparent by making them into a very thin film so that, in principle, the diffusion of atoms within a film is capable of measure by holographic interferometry. Alternatively, the electromagnetic waves within 1 - 70 $mu@m wavelengths may be utilized, some materials, such as high purified germanium and silicon are good materials for infrared transmission. Some fluorides of alkaline-earth metals have high transmittance in the range of 1 - 8 $mu@m, the concentration of impurities in the semiconductor and metal surface treatment are of 10$+15$/ - 10$+20$/ atoms per cubic cm, which is capable of detection.!3
机译:摘要:通过在表面附近深度穿透一些杂质,在半导体中形成p-n结非常重要,因此在扩散过程中控制杂质的浓度分布一直备受关注。近年来,材料科学也吸引了用于金属表面处理的离子渗碳,离子轰击渗透等。要求杂质的扩散深度和扩散时间应受到精确控制。虽然已经采用了放射性同位素检测法和化学分析法等不同的方法,但是不同工人的报告差异很大,尤其是在实时测量中,因此寻找新方法永无止境。 1984年,H。Fenichel用全息干涉法对食盐和糖溶液进行了实验。至于对于可见光不透明的金属,但是通过将它们制成非常薄的膜使它们变得透明,因此,原则上说,膜内原子的扩散能够通过全息干涉测量法进行测量。或者,可以利用波长在1-70μm范围内的电磁波,某些材料,例如高纯锗和硅,是用于红外传输的良好材料。某些碱土金属的氟化物具有高透射率,范围为1-8μm/ m,半导体和金属表面处理中的杂质浓度为10 $ + 15 $ /-10 $ + 20 $ /原子立方厘米,可以检测到!! 3

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