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Effects of Bias Voltage on Microstructure, Hardness and Bonding Strength of TiN Coating Deposited by High Power Pulsed Magnetron Sputtering

机译:偏压对大功率脉冲磁控溅射沉积TiN涂层组织,硬度和结合强度的影响

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The bias voltage exercises a great influence on micro-properties (morphology, preferred orientation, mechanical properties, etc.) of the coatings in the process of coating deposition. In order to more systematically explore the influence of bias voltage on microstructure, hardness and adhesion of TiN coatings, TiN coatings were successfully deposited on the surface of 316 stainless steel by high power pulsed magnetron sputtering (HPPMS). A field emission scanning electron microscopy equipped with energy dispersive spectrometer (FESEM/EDS) and an X-ray diffractometer were employed to analyze the surface morphology, chemical composition and phase structure of coatings, respectively. And a nanoindentation and scratch tester was used to investigate the hardness, elastic modulus and adhesion of TiN coatings. Results showed that bias voltage has a great influence on surface morphology of TiN coatings. Moreover, bias voltage can promote preferential orientation and the phase in TiN coating is mainly TiN with a small amount of Ti_2N. The influence of bias voltage on the hardness and modulus of TiN coating is not obvious, however, the binding force increases fast first and then decreases slow with the increase of bias voltage. TiN coating has excellent performance when bias voltage is -100V.
机译:偏压在涂层沉积过程中对涂层的微观性质(形态,优选取向,机械性质等)产生很大影响。为了更系统地研究偏置电压对TiN涂层的组织,硬度和附着力的影响,通过大功率脉冲磁控溅射(HPPMS)成功地在316不锈钢表面沉积了TiN涂层。采用配备有能量色散谱仪(FESEM / EDS)和X射线衍射仪的场发射扫描电子显微镜分别分析了涂层的表面形态,化学成分和相结构。并使用纳米压痕和划痕测试仪研究了TiN涂层的硬度,弹性模量和附着力。结果表明,偏置电压对TiN涂层的表面形貌有很大影响。而且,偏置电压可以促进优先取向,并且TiN涂层中的相主要是具有少量Ti_2N的TiN。偏置电压对TiN涂层硬度和模量的影响不明显,但随着偏置电压的增加,结合力先快速增大,然后缓慢减小。当偏置电压为-100V时,TiN涂层具有出色的性能。

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