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The Matrix Cracking Stress and Residual Thermal Stress of 2D SiC/SiC Composite Fabricated by PIP Process

机译:PIP法制备二维SiC / SiC复合材料的基体开裂应力和残余热应力

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A two dimensional silicon carbide fiber reinforced SiC matrix (2D SiC/SiC) composite was fabricated by precursor infiltration pyrolysis (PIP) process used a liquid SiC ceramic precursor. Two key properties including matrix cracking stress and residual thermal stress were investigated for this PIP 2D SiC/SiC composite. Three methods were applied to determine the matrix cracking stress in order to obtained a trusted value, and the value of matrix cracking stress for SiC/SiC composite was 75 ± 4 MPa. The residual thermal stress of the composites was calculated by linear regression line according to the loading-unloading-reloading stress-strain curve of the 2D SiC/SiC composite, and the result showed that the value of residual thermal stress of SiC matrix in composite was 20MPa, which means the PIP SiC matrix in the 2D SiC/SiC composite was under the compressive stress when the composite cooling down from the fabrication temperature to the room temperature.
机译:二维碳化硅纤维增强的SiC基体(2D SiC / SiC)复合材料是通过使用液态SiC陶瓷前驱体的前驱体渗透热解(PIP)工艺制造的。研究了该PIP 2D SiC / SiC复合材料的两个关键特性,包括基体开裂应力和残余热应力。为了确定可信值,采用了三种方法确定基体开裂应力,SiC / SiC复合材料的基体开裂应力值为75±4 MPa。根据二维SiC / SiC复合材料的加载-卸载-加载-应力-应变曲线,用线性回归线计算出复合材料的残余热应力,结果表明,SiC基体在复合材料中的残余热应力为20MPa,这意味着当复合材料从制造温度降到室温时,二维SiC / SiC复合材料中的PIP SiC基体处于压缩应力下。

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