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Development of Al doped ZnO as TCO by Atomic Layer Deposition

机译:原子层沉积技术开发掺铝ZnO作为TCO

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Aluminium doped Zinc Oxide (AZO) thin films were deposited on SiO/Si and glass substrates by Atomic Layer Deposition (ALD) in the temperature range of 150 °C - 250 °C. X-ray diffraction revealed the formation of c- axis oriented wurtzite phase of undoped ZnO films. The crystallinity of the films decreased with increasing pulse ratio of Zn:Al which indicating the incorporation of Al in the ZnO lattice. The minimum achievable resistivity (ρ) of the films was 4.8×10-3 Ω-cm with transparency > 80% in the visible range. The bandgap of the materials shows a blueshift with the increasing Al doping concentration.
机译:铝掺杂的氧化锌(AZO)薄膜通过原子层沉积(ALD)在150°C-250°C的温度范围内沉积在SiO / Si和玻璃基板上。 X射线衍射揭示了未掺杂的ZnO薄膜的c轴取向纤锌矿相的形成。膜的结晶度随着Zn:Al脉冲比的增加而降低,这表明Al掺入ZnO晶格中。薄膜的最小可实现电阻率(ρ)为4.8×10-3Ω-cm,在可见光范围内的透明度> 80%。随着Al掺杂浓度的增加,材料的带隙显示出蓝移。

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