The process optimization of the first bail bonding for copper wire

摘要

Copper wire bonding has obtained prevalent owning to its economic advantage and superior electrical property.However,the replacement of gold wire with copper wire introduces hardness related issues as copper is much harder than gold.This article reports investigations of the process optimization of ball bonding for 1.8mil copper wire.The results showed that the suitable ranges of the three key parameters were:contact force was 100～120gf,bond time was 15～25ms,and bond power was 100～110dac.When the input energy was too low,it was hard to get effective bonding.However,excessive input energy would cause chip crater and serious extrusion of metallization layer.