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Feasibility studies for laser solder neurorrhaphy

机译:激光焊接神经性腹泻的可行性研究

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Abstract: We present a novel technique of nerve repair attempting to reduce scarring and improve alignment. A laser solder composed of albumin, hyaluronate, and indocyanine green dye (peak absorbance 805 nm) was used. After applying solder to the anastomotic site, nerve ends can be precisely aligned and sealed in place using an 810 nm diode laser. Transected sciatic nerves in the rat were used as the experimental model. Laser repairs had approximately half the immediate strength of suture repairs (130 vs 280 g/cm$+2$/) but comparable strength by 7 days (270 vs 250 g/cm$+2$/). There was no dehiscence in either group. Thermal damage was confined to the solder and epineurium. At 90 days there was no difference in nerve conduction values or axon counts in suture or laser repairs. Histology was suggestive of a later stage of regeneration in the laser group. Laser soldering produces increased strength compared with traditional laser welding with less thermal injury. !8
机译:摘要:我们提出了一种新的神经修复技术,试图减少疤痕并改善对齐方式。使用由白蛋白,透明质酸盐和吲哚菁绿色染料组成的激光焊料(峰值吸收805 nm)。在将焊料施加到吻合部位后,可以使用810 nm二极管激光器精确对齐神经末端并将其密封在适当的位置。将大鼠中的坐骨神经横断用作实验模型。激光修复的即时强度约为缝合线修复的一半(130 vs 280 g / cm $ + 2 $ /),但强度却相差7天(270 vs 250 g / cm $ + 2 $ /)。两组均无裂开。热损伤仅限于焊料和乙脑。在90天时,缝合或激光修复的神经传导值或轴突计数无差异。组织学提示激光组的再生较晚。与传统的激光焊接相比,激光焊接产生的强度更高,热损伤更少。 !8

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