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Transmission Electron Microscopy Observations on Cu-Mg Alloy Systems

机译:Cu-Mg合金体系的透射电子显微镜观察

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Environmentally friendly Cu-based alloys with high strength and low electrical resistivity have been much sought in order to replace deleterious Cu-Be alloys for electrical applications. As one of the candidate systems, we have examined age-hardening behaviors of Cu-Mg alloys by using transmission electron microscopy (TEM). Cu-2.26wt.%Mg alloys were solution-treated and annealed at 723K, and their structural changes have been investigated. The Vickers hardness measurements showed that they aged-harden gradually. Our TEM observations showed that annealing for 6h brings about precipitation of numerous needle-like particles of 10 nm in length. The diffraction studies indicated these precipitates consist of the Cu_2Mg phase with {111}_(Cu) habit planes. When annealed for 96h, these precipitates become semi-coherent, which was manifested by moire fringes; while maintaining the orientation relationship of (111 )_(Cu)//( 111 )_(Cu_2Mg),
机译:为了代替有害的Cu-Be合金用于电气应用,人们一直在寻求具有高强度和低电阻率的环保Cu基合金。作为候选系统之一,我们使用透射电子显微镜(TEM)检查了Cu-Mg合金的时效硬化行为。对Cu-2.26wt。%Mg合金进行固溶处理并在723K退火,并研究了它们的结构变化。维氏硬度测量结果表明,它们逐渐变硬。我们的TEM观察表明,退火6h会沉淀出许多长度为10 nm的针状颗粒。衍射研究表明,这些沉淀物由具有{111} _(Cu)惯性面的Cu_2Mg相组成。退火96小时后,这些沉淀物变成半连贯的,这表现为莫尔条纹。同时保持(111)_(Cu)//(111)_(Cu_2Mg)的取向关系,

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