Abstract: ease the functionality and complexity of microelectronic components, new packaging techniques such as multichip-modules (MCMs) are used. However, certain MCM manufacturing processes are limited by the yield and reliability of the electrical contacts formed by the solder interconnects or bumps. In this paper we describe an optical measurement system to detect defective electrical contacts before bonding occurs. By using a high-speed, laser-based point range sensor and a high speed part transport system, critical solder bump features such as volume, height and planarity can be measured.!3
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