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SELECTIVE DRY ETCHING OF GaN OVER AlGaN IN BCL_3/SF_6 MIXTURES

机译:BCL_3 / SF_6混合物中GaN在AlGaN之上的选择性干刻蚀

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摘要

Inductively coupled plasma (ICP) etching of GaN with high selectivity over Al_(.22)Ga_(.78)N in BCl_3/SF_6 mixtures has been studied. Selectivity and surface morphology were investigated over a wide range of pressures (3.75-37.5mTorr), RF powers (30-120 W), ICP powers (100-400 W), and SF_6/BCl_3 ratios (0.1-0.7). Higher pressures, lower dc biases, and higher SF_6/BCl_3 ratios increased the GaN to AlGaN selectivity. Selectivities up to 25 were measured by laser interferometry. A root mean square (rms) surface roughness of 0.67 nm was measured by atomic force microscopy (AFM) after removal of 0.5 μm from a GaN template (process selectivity: 15, as-grown rms surface roughness: 0.56 nm). A degradation in surface morphology, with the gradual formation of pits, was observed for selectivities above 10.
机译:研究了在BCl_3 / SF_6混合物中Al _(。22)Ga _(。78)N上具有高选择性的GaN的电感耦合等离子体(ICP)蚀刻。在广泛的压力(3.75-37.5mTorr),RF功率(30-120 W),ICP功率(100-400 W)和SF_6 / BCl_3比(0.1-0.7)范围内研究了选择性和表面形态。更高的压力,更低的直流偏置和更高的SF_6 / BCl_3比值提高了GaN对AlGaN的选择性。通过激光干涉法测量的选择性高达25。在从GaN模板中去除0.5μm后,通过原子力显微镜(AFM)测量了0.67 nm的均方根(rms)表面粗糙度(工艺选择性:15,生长的rms表面粗糙度:0.56 nm)。对于高于10的选择性,观察到表面形貌的降低并逐渐形成凹坑。

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