首页> 外文会议>IEEE Lester Eastman Conference on High Performance Devices; 20040804-06; Rensselaer Polytechnic Institute >A NEW FIELD-PLATED GaN HEMT STRUCTURE WITH IMPROVED POWER AND NOISE PERFORMANCE
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A NEW FIELD-PLATED GaN HEMT STRUCTURE WITH IMPROVED POWER AND NOISE PERFORMANCE

机译:具有改善的功率和噪声性能的新型场镀GaN HEMT结构

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摘要

Field-plated structures can dramatically improve power capacity of GaN HEMT devices. In this paper, two different field-plated GaN HEMT structures will be demonstrated and compared to each other. The results show that a new GaN HEMT structure improves both power and noise performance without additional processing or costs.
机译:场镀结构可以显着提高GaN HEMT器件的功率容量。在本文中,将演示并比较两种不同的场镀GaN HEMT结构。结果表明,新的GaN HEMT结构可提高功率和噪声性能,而无需额外的处理或成本。

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