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DEPENDENCE OF ELECTRON MOBILITY ON EPI CHANNEL DOPING INGaN MOSFETS

机译:电子迁移率对EPI沟道掺杂InGaN MOSFET的依赖性

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摘要

The field-effect mobility and Hall mobility of electrons in lateral, accumulation-mode GaN MOSFETs have been comparatively studied. The devices were fabricated on three different samples, Sample A consisting of 70 nm n-type (N_D = 5x10~(17) cm~(-3)) GaN and Sample B 0.5 μm unintentionally doped (N_D < 1x10~(16) cm~(-3)) GaN, both on 2 μm undoped Al_(0.35)Ga_(0.65)N grown on the n~+-SiC substrates and Sample C 3 μm unintentionally doped GaN on the sapphire substrate. The maximal field-effect mobilities are 120 cm~2/V-s, 90 cm~2/V-s and 53 cm~2/V-s respectively in the three samples. The Hall mobility is also measured for Samples A & B and reaches a maximal value of 160 cm~2/V-s.
机译:已经对横向累积模式GaN MOSFET中电子的场效应迁移率和霍尔迁移率进行了比较研究。器件在三个不同的样品上制造,样品A由70 nm n型(N_D = 5x10〜(17)cm〜(-3))GaN组成,样品B由0.5μm的非故意掺杂(N_D <1x10〜(16)cm 〜(-3))GaN,都生长在n〜+ -SiC衬底上生长的2μm无掺杂Al_(0.35)Ga_(0.65)N上,而蓝宝石衬底上的样品C 3μm则无意掺杂了GaN。三个样品的最大场效应迁移率分别为120 cm〜2 / V-s,90 cm〜2 / V-s和53 cm〜2 / V-s。还测量了样品A和B的霍尔迁移率,并且达到了160 cm〜2 / V-s的最大值。

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