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UNSTRAINED InAlN/GaN HEMT STRUCTURE

机译:无约束的InAlN / GaN HEMT结构

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摘要

InAlN has been investigated as barrier layer material for GaN-HEMT structures, potentially offering higher sheet charge densities and higher breakdown fields. Lattice matched growth of the barrier layer can be achieved with 17 % In content, avoiding piezo polarization. In this configuration the sheet charge density is only induced by spontaneous polarization. First experimental results of unpassivated undoped samples realized on 111-Si substrate exceed a DC output current density of 1.8 A/mm for a gate length of 0.5μm. Small signal measurements yield a f_t = 26 GHz and f_(max) = 14 GHz, still limited by the residual conductivity of the Si-substrate. A saturated output power at 2 GHz in class A bias point yielded a density of 4.1 W/mm at V_(DS) = 24 V.
机译:已经研究了InAlN作为GaN-HEMT结构的阻挡层材料,有可能提供更高的薄层电荷密度和更高的击穿场。 In含量为17%时,可以实现势垒层的晶格匹配生长,避免了压电极化。在这种配置中,薄板电荷密度仅由自发极化引起。在栅极长度为0.5μm的情况下,在111-Si衬底上实现的未钝化未掺杂样品的第一实验结果超过了1.8 A / mm的直流输出电流密度。小信号测量得出f_t = 26 GHz和f_(max)= 14 GHz,但仍受Si衬底的残留电导率限制。在V_(DS)= 24 V时,A类偏置点在2 GHz处的饱和输出功率产生4.1 W / mm的密度。

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