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VERTICAL SCALING OF TYPE Ⅰ InP HBT WITH F_T > 500 GHZ

机译:F_T> 500 GHZ的Ⅰ型InP HBT的垂直标度

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摘要

We have fabricated the high-speed InP/InGaAs-based single heterojunction bipolar transistors (SHBTs) with current gain cutoff frequency, fT from 166GHz to over 500GHz by the approach of vertical scaling. Collector thickness is reduced from 3000A to 750A and the peak current density is increased up to 1300kA/cm2. In this paper, device rf performance has been compared with respect to materials with different vertical dimensions. The scaling limitation is also studied by analytical approach. The extracted physical parameters suggest that the parasitic emitter resistance is the major limit on further enhancing ultra-scaled HBT intrinsic speed due to the associated RECBC delay. The cut-off frequency of a 500A collector SHBT has been measured and the results indicate a dramatic drop on fT, supporting the conclusion projected by model analysis. It is also commented that for deeply downscaled HBTs, impact ionization could be another degrading mechanism limits device bandwidth.
机译:我们通过垂直缩放的方法制造了基于电流InP / InGaAs的高速单异质结双极晶体管(SHBT),其电流增益截止频率为166GHz至500GHz以上。集电极厚度从3000A减小到750A,峰值电流密度增加到1300kA / cm2。在本文中,已经比较了具有不同垂直尺寸的材料的器件射频性能。还通过分析方法研究了缩放限制。提取的物理参数表明,由于相关的RECBC延迟,寄生发射极电阻是进一步提高超规模HBT本征速度的主要限制。测量了500A集电极SHBT的截止频率,结果表明fT急剧下降,支持了模型分析所得出的结论。也有人评论说,对于深度缩小的HBT,碰撞电离可能是限制设备带宽的另一种降级机制。

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