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2 KV 4H-SiC DMOSFETS FOR LOW LOSS, HIGH FREQUENCY SWITCHING APPLICATIONS

机译:用于低损耗,高频开关应用的2 KV 4H-SiC DMOSFET

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摘要

Due to the high critical field in 4H-SiC, the drain charge and switching loss densities in a SiC power device are approximately 10X higher than that of a silicon device. However, for the same voltage and resistance ratings, the device area is much smaller for the 4H-SiC device. Therefore, the total drain charge and switching losses are much lower for the 4H-SiC power device. A 2.3 kV, 13.5 mΩ-cm2 4H-SiC power DMOSFET with a device area of 2.1 mm x 2.1 mm has been demonstrated. The device showed a stable avalanche at a drain bias of 2.3 kV, and an on-current of 5 A with a VGS of 20 V and a VDS of 2.6 V. Approximately an order of magnitude lower parasitic capacitance values, as compared to those of commercially available silicon power MOSFETs, were measured for the 4H-SiC power DMOSFET. This suggests that the 4H-SiC DMOSFET can provide an order of magnitude improvement in switching performance in high speed switching applications.
机译:由于4H-SiC中的高临界场,SiC功率器件中的漏极电荷和开关损耗密度比硅器件高约10倍。但是,对于相同的额定电压和电阻,4H-SiC器件的器件面积要小得多。因此,对于4H-SiC功率器件,总的漏极电荷和开关损耗要低得多。已经证明了器件面积为2.1 mm x 2.1 mm的2.3 kV,13.5mΩ-cm24H-SiC功率DMOSFET。该器件在2.3 kV的漏极偏置下显示稳定的雪崩状态,导通电流为5 A,VGS为20 V,VDS为2.6V。与之相比,寄生电容值要低大约一个数量级。对4H-SiC功率DMOSFET进行了商用硅功率MOSFET的测量。这表明4H-SiC DMOSFET可以在高速开关应用中提高开关性能一个数量级。

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