首页> 外文会议>Fifth Conference on Thermophotovoltaic Generation of Electricity; Sep 16-19, 2002; Rome, Italy >GaSb and Ga_(1-x)In_xSb Thermophotovoltaic Cells using Diffused Junction Technology in Bulk Substrates
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GaSb and Ga_(1-x)In_xSb Thermophotovoltaic Cells using Diffused Junction Technology in Bulk Substrates

机译:在散装基板中使用扩散结技术的GaSb和Ga_(1-x)In_xSb热光电电池

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This paper presents results of experimental and theoretical research on antimonide- based thermophotovoltaic (TPV) materials and cells. The topics discussed include: growth of large diameter ternary GaInSb bulk crystals, substrate preparation, diffused junction processes, cell fabrication and characterization, and, cell modeling. Ternary QaInSb boules up to 2 inches in diameter have been grown using the vertical Bridgman technique with a novel self solute feeding technique. A single step diffusion process followed by precise etching of the diffused layer has been developed to obtain a diffusion profile appropriate for high efficiency, p-n junction GaSb and GalnSb thermophotovoltaic cells. The optimum junction depth to obtain the highest quantum efficiency and open circuit voltage has been identified based on diffusion lengths (or minority carrier lifetimes), carrier mobility and experimental diffused impurity profiles. Theoretical assessment of the performance of ternary (GalnSb) and binary (GaSb) cells fabricated by Zn diffusion in bulk substrates has been performed using PC-1D one-dimensional computer simulations. Several factors affecting the cell performances such as the effects of emitter doping profile, emitter thickness and recombination mechanisms (Auger, radiative and Shockley-Read-Hall), the advantages of surface passivation and the impact of dark current due to the metallic grid will be discussed. The conditions needed for diffused junction cells on ternary and binary substrates to achieve similar performance to the epitaxially grown lattice- matched quaternary cells are identified.
机译:本文介绍了基于锑化物的热光伏(TPV)材料和电池的实验和理论研究结果。讨论的主题包括:大直径三元GaInSb块状晶体的生长,衬底制备,扩散结工艺,电池制造和表征以及电池建模。使用垂直Bridgman技术和新颖的自溶性进料技术,可以生长直径最大为2英寸的三元QaInSb球团。已开发出一步扩散工艺,然后精确蚀刻扩散层,以获得适用于高效p-n结GaSb和GalnSb热光电电池的扩散曲线。根据扩散长度(或少数载流子寿命),载流子迁移率和实验扩散杂质分布,已经确定了获得最高量子效率和开路电压的最佳结深度。使用PC-1D一维计算机模拟对通过Zn扩散在体基板中制造的三元(GalnSb)和二元(GaSb)电池的性能进行了理论评估。影响电池性能的几个因素,例如发射极掺杂分布,发射极厚度和复合机理(俄歇,辐射和肖克利-雷德霍尔)的影响,表面钝化的优势以及由于金属栅而产生的暗电流的影响将是讨论过。确定了三元和二元衬底上的扩散结单元达到与外延生长的晶格匹配四元单元相似的性能所需的条件。

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