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Heat shielding of temperature sensitive optical waveguide components

机译:热敏光波导组件的热屏蔽

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摘要

A number of optical components being developed exhibit, due to the material used in their fabrication, temperature sensitive properties. These properties necessitate that the component is accurately controlled in temperature, in certain cases to +/- 0.1℃ (ambient temperature 0℃-70℃). Using standard techniques this temperature control can be made especially difficult when the material being controlled has a very low thermal conductivity, for example devices made using Lithium Niobate or Polymers. In this paper the thermal aspects of the packaging of these materials are analysed and a heat shielding technique is proposed which is capable of controlling the temperature of the component extremely accurately. Extensive Finite Element Analysis is used to demonstrate the improved performance of the technique. Details of prototype construction and results for these prototypes with Lithium Niobate and Polymer devices are reported and discussed.
机译:由于制造中使用的材料,许多正在开发的光学组件都表现出对温度敏感的特性。这些特性使得必须将组件的温度精确控制,在某些情况下应控制在+/- 0.1℃(环境温度为0℃-70℃)。当被控制的材料具有非常低的导热率时,使用标准技术,例如,使用铌酸锂或聚合物制成的设备,这种温度控制将变得特别困难。在本文中,分析了这些材料包装的热学方面,并提出了一种热屏蔽技术,该技术能够极其精确地控制组件的温度。广泛的有限元分析用于证明该技术的改进性能。报告并讨论了使用铌酸锂和聚合物设备的这些原型的原型构造细节和结果。

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