Chemical Imaging of Micro-vias in Flip Chip Pin Grid Array packages using Time-of-Flight Secondary-Ion-Mass-Spectroscopy

摘要

Distribution of chemical species in cross sectioned micro-via were observed using the Time-Of-Flight-Secondary-Ion-Mass-Spectroscopy (TOF-SIMS). The TOF-SIMS combines high molecular and elemental detection sensitivities and good lateral resolution for detection of molecular and elemental content in the micro-via and surrounding structures of the flip-chip-pin-grid array packages (FCPGA) fabricated from several sources. The data obtained indicate that it is feasible to compare and monitor organic package fabrication processes using TOF-SIMS chemical images.