TEST AND RELIABILITY ANALYSIS OF PBGA ASSEMBLIES UNDER RANDOM VIBRATION

摘要

To understand the high-cycle reliability of Plastic Ball Grid Array (PBGA) interconnections under external random vibration loading, a series of vibration tests of PBGA assemblies were conducted. The test vehicle has four PBGA modules assembled on a Printed Circuit Board (PCB). The assembly was clamped at two opposite sides on a fixture, which was bolted to a vibration shaker. The shaker provided a random out-of-plane vibration excitation. Firstly, the dynamic properties of the assembly under external random vibration excitation were characterized. The resonant frequencies of the assembly were identified, and the maximum dynamic deflection was estimated. Then the reliability tests were carried out. In the reliability tests, the electrical resistance of PBGA modules was continuously monitored, so that any failure could be detected. This paper describes the test procedures, and shows the typical vibration fatigue failures in the PBGA interconnections. Test results will be analyzed in detail.