FEA evaluation on solder joint reliability of CCGA

摘要

3D diagonal sliced models for seven combinations of CCGA package s were built. The FEA results show that, the board level reliability of Package A with interposer is more than two times better than Package B without interposer. But the improvement should be mainly attributed to the bigger and longer columns used by Package A, instead of the interposer. Bigger and longer column and thicker eutectic joint improve the reliability significantly.