Laser brackets debonding - Tm:YAP, Nd:YAG, and GaAs diode lasers evaluation

摘要

The study demonstrates the possibility of using laser radiation for ceramic bracket removing. Three laser radiations were examined for this effect, and the removing possibility and velocity together with enamel and pulp damage were investigated. The lasers used were: a diode-pumped Tm:YAP microchip laser, diode pumped Nd:YAG laser, and GaAs diode generating 1.9 μm, 1.44 μm, and 0.808 μm, respectively. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel - was also made with the goal to explain the source of heat and bracket debonding. The explanation of the debonding effect is also presented. From the results it is possible to conclude that the continuously running diode pumped microchip Tm:YAP laser having output power 1W can be a good candidate for the ceramic bracket debonding procedure.