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MOIRE INTERFEROMETRY FOR COMPOSITE AND SMART MATERIALS

机译:复合材料和智能材料的莫尔干涉

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摘要

High sensitivity Moire interferometry is a coherent light optical technique that features whole field, two-dimensional, real time, and in-plane deformation measurements. The high resolution and high contrast of the fringe patterns enable the observation and analysis in both millimeter and micrometer scales. This paper reports a study on characterization of interface in brittle matrix composite using Moire interferometry. Progressive matrix cracking and interface debonding was recorded, and an interfacial zone of about 50 μm thick carrying large shear deformation was observed. The parameters that were directly measured in laser Moire tests included fiber deformation, matrix deformation, fiber bridging stress, interface slip, interface debonding length, and matrix crack opening. The quantitative fringe analysis was thereafter carried out to determine the interface shear stress distributions by equilibrium as well as interface fracture energy release rate by compliance method. Because of its high sensitivity and high resolution, Moire interferometry is also suitable for the studies of shape memory alloys and different matrix composites.
机译:高灵敏度莫尔干涉仪是一种相干光光学技术,具有完整的场,二维,实时和面内变形测量功能。条纹图案的高分辨率和高对比度使您可以在毫米和微米范围内进行观察和分析。本文报道了利用莫尔干涉测量法表征脆性基体复合材料界面的研究。记录到进行性基体开裂和界面剥离,并且观察到约50μm厚的界面区具有大的剪切变形。在激光莫尔条纹测试中直接测量的参数包括纤维变形,基体变形,纤维桥接应力,界面滑移,界面剥离长度和基体开裂。此后进行定量条纹分析,通过平衡确定界面剪切应力分布,并通过顺应性方法确定界面断裂能释放率。由于其高灵敏度和高分辨率,莫尔干涉测量法也适用于形状记忆合金和不同基质复合材料的研究。

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