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Business opportunities for poly-SiGe as post-CMOSMEMS integration technology

机译:多晶硅SiGe作为CMOSMEMS后集成技术的商机

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This paper discusses the use of poly-SiGe as a post-CMOS MEMS integrationrntechnology. Using this technology, MEMS devices may be processed directly on top ofrnactive CMOS yielding significantly miniaturized systems with increased sensitivity andrnreduced cost. We indicate that this technology has certainly very interesting businessrnopportunities for fast growing markets like ambient intelligence applications, games,rnwireless, displays, ...
机译:本文讨论了将多晶硅多晶硅作为后CMOS MEMS集成技术的用途。使用这项技术,可以在有源CMOS上直接处理MEMS器件,从而显着减小了系统的灵敏度,并降低了成本。我们指出,对于快速增长的市场(例如环境智能应用,游戏,无线,显示器,...等),这项技术无疑具有非常有趣的商业机遇。

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