Improved Wafer Test Using Wireless Probe Cards

摘要

The development of a wireless, non-contact probe card, which dramatically improvesrnsemiconductor wafer test effectiveness and lowers test cost, is presented, and the paths to marketrnacceptance and commercialization are examined. The technology applies to nearly all chips/diernwith active electronics, including standard integrated circuits (Ics), which require testing at thernwafer level. The technology relies on patented short-range, near field communications torntransfer data at GHz bit rates between the probe card and the device under test (DUT) on a wafer.rnThe main advantage of wireless probing is higher reliability (less retest, no pad scrub marks),rnadded functionality (higher test frequencies at higher pin densities), and increased throughputrn(higher parallelism, reduced alignment tolerance, less maintenance, and less downtime).rnA key to market acceptance and commercialization is to ensure that the technology isrncompatible with existing fabrication equipment and processes. As such, the wireless probe cardrninterfaces to standard automated test equipment (ATE), while all antenna structures andrnelectronics needed on the DUT are fully CMOS compliant.rnBased on consultation with semiconductor manufacturers and companies responsible forrndelivering test equipment, three paths to market introduction have been identified. The first is tornsell to "early adopter" designers who will influence the foundries. The foundries will thenrninfluence the cell library vendors who in turn, will influence mainstream designers. The secondrnis to partner with a captive chip producer, who has both design and fabrication facilities. Thisrnoption will permit both the designers and the foundry to be influenced directly. The third coursernis to partner with a test equipment vendor to provide a value-added solution to their line ofrnproducts. The company is actively pursuing all three options.