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The Role of Reliability Models in Commercializing IntegratedMEMS Technology for Telecom Networks

机译:可靠性模型在电信网络集成MEMS技术商业化中的作用

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Micro-technology/MEMS became an important enabling platform in the late 1990's torncope with the increasing bandwidth demands of optical communications. MEMS werernexplored as an alternative to scale-limited electrical switching and tunability needs withrnthe advent of large scale optical cross connect switches (OXC) and tunable lasers.rnHowever, with the telecom crash of 2001, the demand for exponentially increasingrnbandwidth was diminished and system vendors returned to more classical solutions tornmeet customer requirements. A driving force behind the use of traditional componentsrnwas the well established reliability and ageing standards developed both by industryrnorganizations (e.g. Telcordia) and component vendors (e.g. MSA agreements). MEMSrntechnology does not have an equivalent established lifetime prediction model.rnThis paper will discuss the use of a novel reliability model to characterize the lifetime ofrnMEMS devices used in optical communications. The device under study is an integratedrnvariable optical attenuator (VOA) co-packaged with a high-speed receiver module. Therndevice is fabricated using silicon-on-insulator technology combined with bulk micromachiningrnfor release. The mechanical actuation is effected using thermal expansion andrnJoule heating.rnThe customer base for this device is well established and has a pre-determined model forrnassessing the reliability of a system. For example, in one case: 10-20 years of life, subjectrnto >70℃ temperature shifts, and can be stored and handled in harsh environments (>85%rnRH).rnThe lifetime prediction tool commonly employed is an accelerated ageing model basedrnon an Arrhenius performance decay with the activation energy being determined byrnoverloading devices beyond the conditions that they would see in service. This way, 10-rn20 years of lifetime performance can be determined using several months of acceleratedrntesting. The resulting reliability parameter is the FIT (Failure In Time) rate defined as thernnumber of failures in 109 hr of operation.
机译:随着光学通信带宽需求的增长,在1990年代后期,微技术/ MEMS成为重要的支持平台。随着大规模光学交叉连接开关(OXC)和可调谐激光器的问世,人们开始探索MEMS来替代规模有限的电气开关和可调性需求。然而,随着2001年的电信崩溃,对带宽呈指数增长的需求逐渐减少,系统供应商重返市场满足客户需求的更多经典解决方案。使用传统组件的背后推动力是行业组织(例如Telcordia)和组件供应商(例如MSA协议)制定的完善的可靠性和老化标准。 MEMS技术尚未建立等效的寿命预测模型。本文将讨论使用新型可靠性模型来表征光通信中MEMS器件的寿命。研究中的设备是与高速接收器模块一起封装的集成可变光衰减器(VOA)。该设备是使用绝缘体上硅技术结合整体微机械加工制造的。机械致动是通过热膨胀和焦耳加热来实现的。该设备的客户基础已经建立并且具有用于评估系统可靠性的预定模型。例如,在一种情况下:寿命10-20年,温度变化> 70℃,并且可以在恶劣的环境(> 85%相对湿度)中存储和处理。rn寿命预测工具通常是基于加速老化模型的Arrhenius的性能下降,其激活能量由过载设备确定,超出了设备在使用中会看到的条件。这样,可以使用几个月的加速测试来确定10到20年的使用寿命。最终的可靠性参数是FIT(及时失效)率,其定义为109 hr运行中的失效次数。

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